Semiconductor assembly and packaging service market to grow at a CAGR of 4.87% during the period 2018-2022.

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Semiconductor assembly and packaging services are crucial in the semiconductor production process. The package of the semiconductor device is usually made of materials such as plastic, metal, and ceramic/glass. Packaging is undertaken to provide protection against impact and corrosion.
Covered in this report 
The report covers the present scenario and the growth prospects of the global semiconductor assembly and packaging services market for 2018-2022. To calculate the market size, the report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources.
The market is divided into the following segments based on geography: 
• Americas
• APAC
• EMEA
Global Semiconductor Assembly and Packaging Services Market 2018-2022, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market. 
Key vendors 
• ASE
• Amkor Technology
• Intel
• SAMSUNG ELECTRONICS
• SPIL
• TSMC
Market driver 
• Rising number of fabs
• For a full, detailed list, view our report 
Market challenge 
• Requirement of high initial capital investment
• For a full, detailed list, view our report 
Market trend 
• Advances in wafer size
• For a full, detailed list, view our report 

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