E-Chuck for Wafer Market Growth Rate And Industry Price Till, 2019-2023
E-Chuck for Wafer is a tool that clamps an object with the force generated between the electrode and the object by applying a voltage to the electrode. There are two different types of electrostatic clamping methods. One is Coulomb force type that utilizes an insulator as a dielectric material, and the other is Johnson-Rahbek force type that utilizes an attractive force induced by dielectric polarization caused by minute electric current flow across the boundary between an object and a dielectric material. ESCs which are widely used for wafer processing including etching, CVD, PVD, Ashing etc. Ask for free sample copy @ https://www.radiantinsights.com/research/global-e-chuck-for-wafer-market-research-report-2019/request-sample This report studies the global E-Chuck for Wafer market status and forecast, categorizes the global E-Chuck for Wafer market size (value & volume) by manufacturers, type, application, and region. This report focuses on the top manufacturers in Unit...